LeTV Le Max Pro announced with worlds first Snapdragon 820 Soc

Le Max pro powered by Snapdragon 820 quad core Kryo CPU, 4GB of DDR4 RAM, 6.33-inch Quad HD display, 64GB internal storage and 21MP main camera announced at CES 2016

Le max Pro

LeTV Le Max Pro unveiled at CES 2016, which becomes the world first smartphone to announced with Qualcomm Snapdragon 820 processor and Qualcomm Sense ID fingerprint technology that will offer more secure authentication on smartphone. The latest processor Qualcomm Snapdragon 820 also has 802.11 ad multi gigabit Wi-Fi and X12 LTE with Cat. 12/13 download speeds up to 600 Mbps.

LeTV Le Max Pro has a 6.33-inch Quad HD display with 2560×1440 pixel, powered by 64-bit qualcomm snapdragon 820 processor with Adreno 530 Graphics Processor Unit (GPU), coupled with 4GB of LPDDR4 RAM and 64GB of internal storage, runs on Android Lollipop based on EUI.

LeTV Le Max pro

For camera point of view the Le Max Pro is packed with a 21 mega pixel main camera using Sony IMX230 sensor with a f/2.0 aperture dual ISP, OIS, dual tone LED flash and 4 mega pixel front facing camera using Omnivision OV4688 sensor and 81.6 degree wide angle lens

The dual SIM smartphone connectivity features are 4G LTE, 3G HSPA+, Tri band Wi-Fi, Wireless HDMI, MHL 3.0, GPS, NFC and USB Type C port other features of Le Max Pro has LiHI and AKG audio chip for best audio quality, fingerprint sensor with Qualcomm Sense ID. The Le Max Pro backed by 3,400mAH battery.

LETV Le Max Pro Specifications

  • 33-inch quad HD display (2560×1440 pixels)
  • Quad core Qualcomm Snapdragon 820 processor
  • 64GB internal memory
  • Android Lollipop based LEUI
  • 21MP main camera with dual-tone LED flash, Sony IMX230 sensor, OIS, f/2.0 aperture, dual ISP support
  • 4MP front facing camera with OmniVision OV4688, 81.6 degree wide-angle lens
  • 3400mAh battery

LeTV Max pro Features

  • Dual SIM
  • Fingerprint reader with Qualcomm Sense ID
  • Dimension 167.1×83.5×8.95mm and Weight 204g
  • MHL 3.0, USB Type C, Wireless HDMI, LeHIFI and audio chip built by AKG
  • 4G LTE with VoLTE 802.11ad2x2MU-MIMO, Tri-band Wi-Fi, Bluetooth 4.1 with APT-X

The LeTV Max pro is expected to launch later this year, we will have to wait and watch when the LeTV will launch the product and say something about its price. So just tune with us.

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